Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | SMT |
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PCB capability and services: |
1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
4. Quantities range from sample to mass order |
5. 100% E-Test |
SMT(Surface Mounting technology),DIP. |
1. Material Sourcing Service |
2. SMT assembly and Through hole components insertion |
3.100% AOI testing |
4. IC pre-programming / Burning on-line |
5.ICT testing |
6.Function testing as requested |
7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
8.Conformal coating |
9.OEM/ODM also welcomed |
Production Capacity | |
PCB Max. size | DIP capacity |
Min component size | 0201 |
Min.pin space of IC | 0.3mm |
Min. space of BGA | 0.3mm |
Max.precision of IC assembly | ±0.03mm |
SMT capacity | ≥2 million points/day |
DIP capacity | ≥100k parts/day |
EMS Capacity | |
electronic product final assembly | 100k/month |
PCB assembly OEM service
PCBA ODM service
One-stop PCBA | PCB+components sourcing+assembly+test+package |
Assembly details | SMT and Thru-hole |
Lead Time | Prototype: 7-15 work days. Batch order 20~25 work days usually |
Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, Functional test |
PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
Components details | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly process |
Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing |