| Customization: | Available |
|---|---|
| Integrated Graphics: | Integrated Graphics |
| Main Chipset: | Intel |
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| CPU | Intel®Raptor Lake & Alder Lake Processor |
| Chipset | Intel® SOC |
| Display | Intel® Iris® Xe Graphics Card |
| Display output | LVDS/EDP1+EDP2+HDMI+VGA |
| Multi-display | Four displays synchronously and asynchronously |
| USB | 2*USB3.2 Gen2(10Gbps Optional1*type-C) 2*USB3.2 Gen1(5Gbps); 7*USB2.0 |
| Memory | 2*SO-DIMM DDR4 3200MHz Max64GB |
| Audio | Onboard ALC897 audio decoding controller, Independent power amplifier NS4251, 3W@4Ωmax |
| Lan | Onboard 1*RTL8111H Gigabit network card (optional dual network) |
| Storage | 1*M.2 M Key ; 1*SATA3.0 Port |
| Expansion | 1*M.2 E Key,Support Wifi6/Bluetooth module 1*M.2 B Key,support 4G/5G module |
| I/O chip | IT8786E |
| BIOS | AMI BIOS |
| Power | DC/4Pin ATX 12~19V |
| Cooling | With fan |
| Environment | Working: 0~60ºC; Storage: -20ºC~75ºC0% ~ 95% relative humidity, no condensation |
| Size | 170X170mm |
| Rear I/O interface |
1*DC_IN port 1*HDMI port 1*VGA port 1*Clear_CMOS button 2*USB3.2 Gen2 (10Gbps) optional 1*type-C 2*USB2.0 ports (optional LAN2)1*LAN1 port 1*LINE_OUT port 1*MIC_IN port |
| Internal I/O pins | 1*Speaker pin 1*F_AUDIO pin 1*LVDS pin 1*EDP1 pin 1*INVCN pin 1*SATA pin, 1*SATA_PWR pin 1*JUSB1 (expandable 2*USB3.2 Gen1 5Gbps) 3*F_USB (expandable 5*USB2.0) 1*LPT pin, 1*PS2 pin 1*GPIO pin 1*TPM pin 1*F_PANEL pin 6*COM pins, 1*CFAN pin 1*SFAN pin 1*EDP2 pin 1*VGA pin, 1*HDMI pin 1*ATX socket |
PCB assembly OEM service
PCBA ODM service
| One-stop PCBA | PCB+components sourcing+assembly+test+package |
| Assembly details | SMT and Thru-hole |
| Lead Time | Prototype: 7-15 work days. Batch order 20~25 work days usually |
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, Functional test |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
| PCB assembly process |
Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing |
Shenzhen Grandtop Electronics Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have rich experience in the industrial control computer hardware industry. We are motherboard manufacturer. We research and develop products, purchase raw materials, produce products, control quality, sales, and after-sales. We are familiar with the entire industry, our products are selling well, our prices are advantageous, and our products are guaranteed.
Founded in: 2005
Certifications: ISO13485, IATF16949, UL, CE, RoHS, etc.
One-Stop OEM PCB Assembly Professional Turnkey PCBA: providing professional PCB design, R&D prototyping, PCBA mass production, component procurement, electronic product assembly, testing, PCBA conformal coating and supporting services for electronic and electrical products peripheral products such as wire harnesses, plastic injection, sheet metal, etc.
IP Protection: Strong believe in IP protection with proven records.
Packing: Bubble packing&paper box.carton&pallet, or customized packing as your request
Delivery time: Generally it is 4-9 days if the goods are in stock. or it is 15-20 days if the goods are not in stock it is according to quantity .
Professional goods shipping forwarder.
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