Customization: | Available |
---|---|
Integrated Graphics: | Integrated Graphics |
Main Chipset: | Intel |
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CPU
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Intel®Tiger Lake-UP3 Processor 1135G7/1145G7
|
Chipset
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Intel® SOC
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GPU
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Intel UHD Graphics 600
|
Display
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LVDS1/EDP1+EDP2+HDMI+VGA
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Muilt display
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Four Display(synchrony/asynchrony)
|
USB
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2*USB3.2 Gen2(10Gbps) ,2*USB3.2 Gen1(5Gbps),6*USB2.0
|
Memory
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2*SO-DIMM DDR4 3200MHz Max32GB
|
Audio
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Onboard ALC897 audio decoder controller;
Built-in Amplifier NS4251 3W@4Ω MAX |
Network
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Onboard 2*Realtek RTL8111H/8111Ggigabit network card
|
Storage
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1*M.2 M Key ,support PCIEX2/SATA
1*SATA III(6.0 Gb/s) |
Slot
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1*M.2 E Key,support Wifi6/bluetooth module;
1*M.2 B Key,support 4G/5G wifi module; 1*SIM |
I/O chip
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IT8786E-I
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BIOS
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AMI BIOS
|
Power
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DC/4PIN ATX 12V power supply
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Colling
|
Fan
|
Environment
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Operating:0~60ºC;
Storage: -20~75ºC 0%~95% Relative Humidity,Non-condensing |
Size
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170X170mm
|
Rear I/O
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1*DC_IN
1*HDMI 1*VGA 1*CLR_CMOS 2*USB3.2 Gen2(10Gbps) 1*LAN2(2*USB2.0) 1*LAN1 1*F_OUT 1*F_MIC |
Internal I/O
|
1*F_AUDIO pin
1*Speaker pin 1*INVERT pin 2*EDP pin 1*LVDS pin 1*BKCL pin 1*SATA pin 1*SATA_PWR pin 1*F_USB1( extended 2*USB3.2 Gen1) 3*F_USB2.0( extended 6*USB2.0) 1*LPT pin 1*JPS2 pin 1*GPIO pin 1*TPM pin 1*F_PANEL pin 6*COM pin 1*CFAN pin 1*SFAN pin 1*JHDMI pin 1*JVGA pin 1*ATX_IN |
PCB assembly OEM service
PCBA ODM service
One-stop PCBA | PCB+components sourcing+assembly+test+package |
Assembly details | SMT and Thru-hole |
Lead Time | Prototype: 7-15 work days. Batch order 20~25 work days usually |
Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, Functional test |
PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
Components details | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly process |
Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing |
Shenzhen Grandtop Electronics Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have rich experience in the industrial control computer hardware industry. We are motherboard manufacturer. We research and develop products, purchase raw materials, produce products, control quality, sales, and after-sales. We are familiar with the entire industry, our products are selling well, our prices are advantageous, and our products are guaranteed.
Founded in: 2005
Certifications: ISO13485, IATF16949, UL, CE, RoHS, etc.
One-Stop OEM PCB Assembly Professional Turnkey PCBA: providing professional PCB design, R&D prototyping, PCBA mass production, component procurement, electronic product assembly, testing, PCBA conformal coating and supporting services for electronic and electrical products peripheral products such as wire harnesses, plastic injection, sheet metal, etc.
IP Protection: Strong believe in IP protection with proven records.
Packing: Bubble packing&paper box.carton&pallet, or customized packing as your request
Delivery time: Generally it is 4-9 days if the goods are in stock. or it is 15-20 days if the goods are not in stock it is according to quantity .
Professional goods shipping forwarder.