Production Ability For PCB |
Layer: |
1-40 layer |
Surface: |
HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. |
Copper thickness: |
0.25 Oz -12 Oz |
Material: |
FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers |
Board thickness |
0.1 to 6.0mm(4 to 240mil) |
Minimum line width/space |
0.076/0.076mm |
Minimum line gap |
+/-10% |
Outer layer copper thickness |
140um(bulk) 210um(pcb prototype) |
Inner layer copper thickness |
70um(bulk) 150um(pcb protytype) |
Min.finished hole size(Mechanical) |
0.15mm |
Min.finished hole size (laser hole) |
0.1mm |
Aspect ratio |
10:01(bulk) 13:01(pcb prototype) |
Solder Mask Color |
Green,Blue,Black,White,Yellow,Red,Grey |
Tolerance of dimension size |
+/-0.1mm |
Tolerance of board thickness |
<1.0mm +/-0.1mm |
Tolerance of finished NPTH hole size |
+/-0.05mm |
Tolerance of finished PTH hole size |
+/-0.076mm |
Delivery time |
Mass:10~12d/ Sample:5~7D |
Capacity |
35000sq/m |
Production Ability For PCB Assembly |
Stencil Size: |
640x640mm |
Minimum IC Pitch: |
0.2mm |
Minimum chip size: |
0201 (0.2x0.1) |
Min. space of BGA: |
0.3mm |
Max.precision of IC assembly: |
±0.03mm |
SMT capacity: |
≥2 million points/day |
DIP capacity: |
≥100k parts/day |
electronic product final assembly: |
electronic product final assembly: |
Certification: |
ISO9001:2015, ISO13485:2016, IAFT16949:2016 |