Gold Finger Printed Circuit Boards

• Customization: Available
• Metal Coating: Copper
• Mode of Production: SMT
• Model NO.: GET-pcba9
• Layers: Multilayer
• Base Material: FR-4
• Certification: RoHS, ISO
• Customized: Customized
• Condition: New
• Transport Package: ESD Bag, Carton Box
• Specification: 174*36mm
• Trademark: GT
• Origin: China
• HS Code: 8517709000
• Production Capacity: 30000PCS/Month

Product Description

Gold finger printed circuit boards

Grandtop PCBA is a professional PCBA solution service provider specialized in one-stop service for  PCB assembly, components sourcing, contract manufacture,function testing, as well as electronic products final assembly.

Our Advantages:
-PCBA OEM &ODM services
-Components sourcing
-Plastic and metal casing design&production services
-PCBA assembly (SMT, DIP, MI, AI)
-PCBA testing (AOI testing, ICT testing, functional testing)
-Burn-in testing
-Turnkey assembly and final testing(including plastic,metal casing,PCBA motherboard,cables,switches and other components, etc.)
-Logistics arrangements, importing and exporting goods from China
-Dust-Free workshop
-Perfect quality guarantee such as ISO9001:2008 & ISO13485:2016(Medical product ) and ROHS& UL certified;




 

Production Ability For PCB
Layer:	1-40 layer
Surface:	HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect.
Copper thickness:	0.25 Oz -12 Oz
Material:	FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum  BT,Rogers
Board thickness	0.1 to 6.0mm(4 to 240mil)
Minimum line width/space	0.076/0.076mm
Minimum line gap	+/-10%
Outer layer copper thickness	140um(bulk)  210um(pcb prototype)
Inner layer copper thickness	70um(bulk) 150um(pcb protytype)
Min.finished hole size(Mechanical)	0.15mm
Min.finished hole size (laser hole)	0.1mm
Aspect ratio	10:01(bulk)  13:01(pcb prototype)
Solder Mask Color	Green,Blue,Black,White,Yellow,Red,Grey
Tolerance of dimension size	+/-0.1mm
Tolerance of board thickness	<1.0mm     +/-0.1mm
Tolerance of finished NPTH hole size	+/-0.05mm
Tolerance of finished PTH hole size	+/-0.076mm
Delivery time	Mass:10~12d/ Sample:5~7D
Capacity	35000sq/m
Production Ability For PCB Assembly
Stencil Size:	640x640mm
Minimum IC Pitch:	0.2mm
Minimum chip size:	0201 (0.2x0.1)
Min. space of BGA:	0.3mm
Max.precision of IC assembly:	±0.03mm
SMT capacity:	≥2 million points/day
DIP capacity:	≥100k parts/day
electronic product final assembly:	electronic product final assembly:
Certification:	ISO9001:2015, ISO13485:2016, IAFT16949:2016

Our workshop