| Customization: | Available |
|---|---|
| Integrated Graphics: | Integrated Graphics |
| Main Chipset: | Intel |
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CPU
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Intel® Kaby Lake & Skylake Processor
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Chipset
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Intel® SOC
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Display chip
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Intel ® Core graphics card
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Display output
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LVDS+HDMI+VGA
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Multi display support
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Three display synchronous asynchronous
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USB
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2*USB3.2 Gen2(10Gbps),8*USB2.0
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Memory
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1*SO-DIMM DDR4 2133MHz Max32GB
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Sound effects
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On board ALC269 audio decoding controller; Independent power amplifier NS4251(3W@4ΩMAX)
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Network card
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On board 2 * Intel I226-V (transmission rate 2.5Gb)
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Storage
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1*SATA Port ; 1*mSATA
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Expansion slot
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1 * mPCIE, supporting WiFi/Bluetooth/4G module expansion
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I/O chip
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IT8786E-I
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BIOS
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AMI BIOS
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Power supply
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DC/2PIN AT 12~24V Wide voltage power supply
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Cooling System
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Equipped with fanless heat sink
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Environment
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Working temperature: 0-60 ºC;Storage:-20ºC~75ºC0%~95%relativehumidity,noncondensing
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Size
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145X100mm
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Post I/O interface
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1 * DC_ IN port
1 * VGA port 1 * HDMI port 2 * USB3.2 Gen 1 (5Gbps) port 1 * LAN1 port 1 * LAN2 port 1 * AUDIO interface |
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Internal I/O
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1 * Speaker pin
1 * F_ PANEL pin 1 * LVDS pin 1 * INVERT socket 1 * BKCL pin 4 * F_ USB 2.0 pin (expandable 8 * USB 2.0) 6 * COM pin 1 * GPIO pin 1 * SATA_ PWR socket 1 * SATA socket 1 * AT_ IN socket |
PCB assembly OEM service
PCBA ODM service
| One-stop PCBA | PCB+components sourcing+assembly+test+package |
| Assembly details | SMT and Thru-hole |
| Lead Time | Prototype: 7-15 work days. Batch order 20~25 work days usually |
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, Functional test |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
| PCB assembly process |
Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing |
Shenzhen Grandtop Electronics Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have rich experience in the industrial control computer hardware industry. We are motherboard manufacturer. We research and develop products, purchase raw materials, produce products, control quality, sales, and after-sales. We are familiar with the entire industry, our products are selling well, our prices are advantageous, and our products are guaranteed.
Founded in: 2005
Certifications: ISO13485, IATF16949, UL, CE, RoHS, etc.
One-Stop OEM PCB Assembly Professional Turnkey PCBA: providing professional PCB design, R&D prototyping, PCBA mass production, component procurement, electronic product assembly, testing, PCBA conformal coating and supporting services for electronic and electrical products peripheral products such as wire harnesses, plastic injection, sheet metal, etc.
IP Protection: Strong believe in IP protection with proven records.
Packing: Bubble packing&paper box.carton&pallet, or customized packing as your request
Delivery time: Generally it is 4-9 days if the goods are in stock. or it is 15-20 days if the goods are not in stock it is according to quantity .
Professional goods shipping forwarder.
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