Customization: | Available |
---|---|
Type: | Combining Rigid Circuit Board |
Dielectric: | FR-4 |
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PCB Capacity
No | Items | Capability |
1 | PCB Layers | 2 ~ 15 layers |
2 | PCB Base Material | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium |
3 | PCB Finished Board Thickness | 0.2mm ~ 7.0mm(8mil-276mil) |
4 | PCB Copper Thickness | 1/3oz ~ 7oz |
5 | PCB Surface Finishing | HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc. |
6 | PCB Max gold plating thickness | 50 microinch |
7 | PCB Min. Trace Width/Space | 0.075/0.075mm(3/3mil) |
8 | PCB Min. Finish Holes Size | 0.1mm(4mil) for laser holes; 0.2mm(8mil) for mechanical holes |
9 | PCB Max. Finshed Size | 600mm X 900mm (23.6" X 35.43") |
10 | PCB Hole Tolerance | PTH: ±0.076mm(+/-3mil), NTPH: ±0.05mm(+/-2mil) |
11 | PCB Soldermask Color | Green, White, Black, Red, Yellow, Blue, |
12 | PCB Silkscreen Color | White, Black, Yellow, Blue |
13 | PCB Impedance Control | +/-10% |
14 | PCB Profiling Punching | Routing, V-CUT, Chamfer |
15 | PCB Special Holes | Blind/Buried holes, Countersunk holes |
16 | PCB Reference Standard | IPC-A-600H Class 2, Class 3, TS16949 |
17 | PCB Certificate | UL, ISO9001, RoHS, SGS |
18 | PCB Package | Vacuum & Carton |
PCBA Capacity
NO | Items | Capability |
1 | PCB Assembly Min. IC Pitch | 0.30mm(12mil) |
2 | PCB Assembly Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
3 | PCB Assembly Min. Chip Placement | 01005 |
4 | PCB Assembly Max. PCB Size | 410mm X 600mm(16.2" X 23.6") |
5 | PCB Assembly Min. PCB Thickness | 0.35mm(13.8mil) |
6 | PCB Assembly Maximum BGA Size | 74mm X 74mm(2.9" X 2.9") |
7 | PCB Assembly BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
8 | PCB Assembly BGA Ball Diameter | 0.4mm ~ 1mm(16mil ~ 40mil) |
9 | PCB Assembly QFP Lead Pitch | 0.38mm ~ 2.54mm(15mil ~ 100mil) |
10 | PCB Assembly Package | Anti-static Bubble Bag & Carton |
Our service :
Company Information :
Shenzhen Grandtop Automation Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have more than 10 years of SMT manufacturing experience, well appointed SMT ,DIP and assembly lines, offering one stop service from SMT,FPC,DIP,EMS, conformal coating, testing, final assembly, component procurement ,design, peripheral products support and so on. we are equipped with High-speed and accurately SMT Equipment ,and we provide a whole range of SPI,AOI,ICT,FCT,X-RAY,ROHS and aging testing for products. All ourshop floors are dust free, all lines are lead free, we are ISO9001 certified company.